The global market for Bonding Wire Packaging Material is growing and is expected to increase during the forecasted period.
The diameter of bonding wires ranges from 15 micrometers to several hundred micrometers for high-powered applications. An important market trend that is expected to boost the global Bonding Wire Packaging Material market is the migration to smaller diameter wires. This migration is primarily fueled by the increasing demand for miniaturization. Manufacturers are using bonding wires as an intermediate product opts for small diameter bonding wires because it is an effective way to reduce costs, as materials used in bonding wires such as gold accounts for majority of the expense.
The growing demand for miniaturization in the semi-conductor industry is also leading to an increasing use of bonding wires as an important part of electronic assemblies. This is another factor driving the growth of the market for Bonding Wire Packaging Material. Fine and ultrafine bonding wires of palladium, copper, aluminum, and gold are used in the production of bonding wires. Uniform wires with quality is in high demand. Since the semi-conductor industry is constantly evolving, there is a need for the vendors in this market to continually upgrade their offerings with more compact and advanced packaging materials, such as wires with smaller diameter, to cater to the customer requirements.
Despite a number of factors driving the growth of the market for Bond Wire Packaging Material there are some factors restraining the market. One such challenge is the growing demandof flip chip packaging technology. The key advantage of flip chip technology over bonding wires is the elimination of the technical limitations of the bonding wires by providing an area-array interconnect and significantly lowering interconnect inductance, enabling higher frequency performance.
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