Semiconductor wafers frame a necessary piece of different parts utilized plentifully in various electronic gadgets. The quality and execution of electronic gadgets is straightforwardly corresponding to the nature of semiconductor wafers utilized as a part of it. High caliber of wafer surface is exceptionally basic for reasonable and simple manufacture of extensive scale mix (VLSI) and ultra-substantial scale incorporation (ULSI) circuits. In this way, most extreme quality measures is followed in the assembling procedure of semiconductor wafers to influence them to free from sullying.
Nearness of soil or undesirable materials amid semiconductor wafer producing process, brings about debasement of wafer’s quality and thus influences the execution of electronic gadgets contrarily. Consequently, significance of wet based wafer cleaning equipment is anticipated to increment broadly crosswise over different semiconductor industry amid the conjecture time frame from 2017 to 2025 for influencing these wafers sullying to free and to guarantee more prominent creation yield. Wet based wafer cleaning equipment utilizes unadulterated water and chemicals to expel any stains and tidy that reason obstruction in the assembling procedure of semiconductor wafers.
Expanding demand for semiconductor wafer for various application territories, for example, buyer electronic gadgets, sensor gadgets, correspondence and memory gadgets among others is anticipated to build the generation of semiconductor wafers. This thus, is foreseen to build the request of wet based wafer cleaning equipment inferable from ease of proprietorship and consenting to different security models. Additionally, the rising pattern of scaling down semiconductor coordinated circuits (ICs) is required to trigger the creation of conservative semiconductor wafers, which thusly is foreseen to increase the request of wet based wafer cleaning equipment comprehensively.
In order to provide a detailed and in-depth analysis of the market, the global wet based wafer cleaning equipment market has been segmented on the basis of application and end user. Based on removal of elements, by application, the market has been classified into chemical contamination, metallic contamination and particle contamination. In addition, data related to demand for wet based wafer cleaning equipment across various end user industry including radio frequency identification (RFID) devices, logic and memory, micro electro mechanical system (MEMS), CMOS (complementary metal oxide semiconductor) image sensor and power devices is also provided in this report.
Among the different applications, removal of metallic contamination held the largest market share in 2016 and is expected to hold its leading position in the coming years. Metallic contamination is one of the prime reasons for semiconductor device failure. Metallic contamination adversely affects semiconductor device performance. When wafer is contaminated with metallic impurities, it is known as metallic contamination. Aluminum (Al), Copper (Cu), Chromium (Cr), Iron (Fe), Zinc (Zn), and Nickel (Ni) are some of the common contaminants. Metallic contaminants primarily cleaned by using water and liquid chemicals.
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Geographically, in 2016, Asia Pacific region generated the revenue in the global wet based wafer cleaning equipment and is also predicted to experience the highest growth during the forecast period from 2017 to 2025. The market of wet based wafer cleaning equipment in Asia Pacific region is majorly driven by the countries such as China, Taiwan and India among others. Huge concentration of semiconductor manufacturing company in this region coupled with increasing demand for technologically advanced and superior performing electronic devices is the most important factor anticipated to accelerate the demand of thinned and clean wafers. This in turn is predicted to boost the demand of wet based wafer cleaning equipment in Asia Pacific region.
Some of the major players supplying wet based wafer cleaning equipment across the globe includes SCREEN Holdings Co. Ltd. (Japan), Cleaning Technologies Group (The U.S), Modutek Corporation (The U.S), Lam Research Corporation (the U.S) and Tokyo Electron Limited (Japan) among others.